Comprehensive research datasets for ISO 10303-210 (AP210) Electronic Assembly, Interconnect and Packaging Design applications.
- NIST (National Institute of Standards and Technology)
- PDES Inc.
- nist-ap210-cfd/ - Computational Fluid Dynamics project data
- nist-ap210-gdt/ - Geometric Dimensioning & Tolerancing projects (connectors and packages)
- nist-ap210-spice/ - SPICE circuit simulation integration project data
- pdes-ap210viewer/ - AP210 visualization and viewing tool data
- pdes-idf2ap210/ - IDF to AP210 conversion project data
- documentation/ - Data dictionaries, methodologies, and technical documentation
This dataset is released under Creative Commons Attribution 4.0 International License (CC-BY 4.0).
When using this data, please cite:
NIST, PDES Inc. AP210 Research Data Archive.
https://github.com/expresslang/ap210-research-data
DOI: https://doi.org/10.5281/zenodo.16496290
- Main Project Site: ap210.org
- Research Project Descriptions: ap210.org/research
This research data archive provides materials for advancing the state of electronic design automation and standards-based data exchange in the electronics industry.